The surfaces of electronic components and chips are typically covered with circuits and nodes, resulting in an uneven topography; since traditional spraying methods cannot achieve uniform coating on such surfaces, we employed ultrasonic spraying technology.

Ultrasonic nozzles operate by converting high-frequency sound waves into mechanical energy, which is transmitted to the liquid to generate standing waves. As the liquid exits the nozzle's atomizing surface, it breaks apart into a fine mist of uniform, micron-sized droplets.

The ultrasonic spray nozzle is mounted on a three-axis motion module or a robotic arm; as the nozzle's orientation and movement trajectory are completely unrestricted, it can uniformly coat workpieces of any shape, including those with complex, uneven surfaces.

The JH-TWG01 ultrasonic semiconductor coating equipment is a fully enclosed, programmable 3-axis robotic sprayer compatible with various ultrasonic nozzles, making it an ideal choice for a wide range of spraying applications. Users can select the appropriate ultrasonic nozzle based on specific application requirements and customize spraying paths and zones; the spray width is adjustable within a range of 1–80 mm. A precision syringe pump ensures accurate liquid delivery across a broad flow rate range. In terms of production capacity, this equipment is best suited for laboratory R&D and small-scale production.